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For your reference, we have included the original job posting below.
Sr Substrate Engineer
Job Number:
25935718
Company Name:
SanDisk
Job Location:
Taichung, TW
Job Category:
Information Technology
Sr Substrate Engineer
AutoReqId 6131BR Job Title Sr Substrate Engineer SanDisk Job Description In this position, the individual will be responsible for optimizing die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack die packages and memory card PCB, exploring routing and placement changes that could lower the substrate complexity and cost, and providing substrate layout feasibility and documentation for laminate package designs. The individual will perform Design Library maintenance and bonding diagram generation, perform cost/performance trade-off analysis of various packages either in production or under development, interface seamlessly with product managers, substrate designers, manufacturing and assembly engineering and layout groups at the assembly subcontractors, working closely with various manufacturing and packaging groups at various SanDisk locations for new product development and substrate / PCB design improvement, and work with assembly houses and substrate / PCB vendors on design review and design rule maintenance. Lastly the individual will establish a DFM(design for manufacturability) process working closely with Substrate/PCB layout groups, work closely with Substrate/PCB manufacturing suppliers for technology developments, perform cost/performance trade-off analysis of various substrate/PCB design rules either in production or under development, interface seamlessly with product managers, substrate/PCB designers, manufacturing and assembly engineering and substrate/PCB manufacturing suppliers, and work closely with Substrate/PCB manufacturing suppliers and packaging groups at various SanDisk locations for new product development and substrate/PCB design improvement.
This position requires a BS/BA in Engineering with a minimum of 3 years of substrate design experience using Cadence APD and the ability to work with substrate and other laminate material suppliers, while working experience in semiconductor assembly and in a substrate manufacturing environment will be added advantages. The individual must possess good computer and AutoCad / CAM350 or other equivalent CAD skills and experience in use of general signal integrity tools such as Ansoft and Sigrity is desirable. The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment. The individual must be self-motivated and self-directed, however, must have also demonstrated ability to work well with people and have a proven desire to work as a team member, both on the same team and outside of the team. In addition, the individual must have the abilities to work effectively cross-functionally, coordinate priorities and initiatives, troubleshoot and analyze complex problems, and to manage multiple projects simultaneously while meeting deadlines. Excellent communication (written and verbal) and interpersonal skills are required.
SanDisk offers a highly competitive compensation package and great benefits. SanDisk is an equal opportunity employer. Location Taiwan-Taichung Job Function Engineering
