Sr. Product Engineer

Sr. Product Engineer

Sr. Product Engineer
Job
code: 3134
Job Category: Engineering
City: Palo Alto
Job Description:
Sr. Product Engineer
Job Description:
Our client is looking for a Sr. Product Engineer for semiconductor Integrated Circuits for multimarket application, including Fiber Optics Telecom, Instrumentation and Defense. The candidate must have strong knowledge in multiple semiconductor technologies, in particular IIIV, both bipolar and pHEMT, and BICMOS. They also need solid experience in product design for volume manufacturing for high speed, high performance, high voltage broadband amplifiers, low noise and trans-impedance amplifiers and high speed digital or mixed signal products. They also need a strong knowledge on semiconductor IC reliability related issues. Also required is industry qualification processes and mass production transfer of products at both die and packaged level.
The ideal candidate will work directly with various R&D teams and product marketing managers since the initial product definition, creating policies and procedures necessary to ensure quality, efficient, cost effective production.
They will responsible for the Telecom IC high speed components product line and will work within a team of reliability and test engineers and technicians involved on the product characterization and qualification process to transfer design from engineering prototypes to mass production working with both in-house manufacturing team and external contract manufacturers.
The position requires high level of motivation, experience in fables semiconductor companies, hands-on attitude and capabilities and ability to work independently in a fast-paced environment.
Responsibilities and skills may include:
Define suitable product engineering infrastructure for rapidly fabless company;
Manage reliability analysis and standard qualification processes, optimizing efficiency of overall qualification of different product families;
Plan product test and software developments for pilot test characterization, production environment test at both wafer level and packaging level, reducing test time and overall test cost;
Monitor and process pre-production and production data to confirm production datasheet;
Manage product reliability and product yield enhancement;
Hands-on engineering capabilities in debugging, failure analysis, electrical device characterization, optical tests;
Experience in multi-chip high speed packaging technology and design, related production and external contract manufacturing houses;
Experience in dealing with GaAs, InP and SiGe/CMOS technologies foundries;
Work with quality control team. Interface with design, sales and application to contribute to customer issues resolution.
Education requirements:
MSEE and minimum 10 years of experience in product engineering including 5 years in a fab-less company, involving GaAs or other IIIV technologies.
Knowledge requirements:
Semiconductor and packaging technology.
Thermal considerations and analyses.
Product reliability analyses and related tests.
High speed broadband IC test and characterization.
Parametric test and yield analysis softwares.
Experience with optical components as well is preferable
If interested, please send your resume as a word attachment toJason@