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For your reference, we have included the original job posting below.
Signal Integrity Engineer- Intern
Job Number:
42638950
Company Name:
Silicon Graphics
Job Location:
CHIPPEWA FALLS, WI US
Job Category:
Information Technology
Signal Integrity Engineer- Intern
Job Code: 47190 Job Title: Signal Integrity Engineer- Intern City: CHIPPEWA FALLS State/Province: WI Job Description: Description:
The signal integrity engineering group at SGI is responsible for carrying out all aspects of signal integrity analysis on SGI's high performance server products. These responsibilities include: (1) generation of electrical rules for the design and layout of complex circuit board assemblies incorporating multi-gigabit/sec communications channels, (2) analysis of high data rate communications channels incorporating SERDES circuits with equalization capabilities, (3)construction of models for lossy transmission lines, via structures, connectors, cables, and arbitrary passive pcb structures using 2D and 3D field solvers, (4) analysis of channel performance using HSpice simulations, (5) analysis of power distribution systems to include the effects of simultaneous switching noise, capacitive decoupling, and multi-layer printed circuit board power delivery, (6) generation of specific signal routing rules to enable the control of impedance, crosstalk, and signal amplitude/timing, and (7) design verification during hardware bringup utilizing common lab equipment such as digital sampling oscilloscopes, time domain reflectometers, and vector network analyzers. The signal integrity engineering team at SGI has an opening for a summer intern to provide support for the above defined activities. The specific emphasis of this summer intern project will be for characterization of interconnect structures using the Agilent N5230A PNA-L network analyzer combined with the generation of transmission line models using ANSYS HFSS and/or Sigrity PowerSI.
Job Requirements: Skillsets:
- Simulation environments using Spice and/or Matlab - Transmission line theory - An understanding of S-Parameters for interconnect characterization/modeling - Multi-layer printed circuit board design techniques - Familiarity with HFSS or other full wave 3D electromagnetic field solvers a plus - Excellent communication skills both verbally and written
Education:
- Bachelor of Science Degree in Electrical Engineering
Category: US Server & Platform Apply On-line Send This Position to a Friend
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